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■ Patent Coulomb-Force E-Chuck (Electrostatic Chuck) :

​Patent Coulomb-Force E-Chuck has been developed long time and has dozens of international patents.

Advanced technology enclose electrical field in the E-Chuck. E-Chuck become a move-free carrier. After adhesion setting, Move-Free Supporter can disconnect the power supply and still keep adhesion force. Move-Free support can support hardness or shape reinforcements for thin wafer or glass panel.

Patent Coulomb-Force E-Chuck has best characteristics than many electrostatic chucks under long-term advanced researches and developments. Patent Coulomb-Force E-Chuck is a ideal handling tool for soft and thin materials.

■ Adsorbable Material
(1) Metal conductor (e.g., copper foil)
(2) Semiconductors (e.g., silicon, GaAs)
(3) Insulators (e.g., paper, glass panel)
(4) Porous objects.
(5) The adsorption force per unit area is related to the adsorption material and the contact surface smoothness.
(6) Material ranking of the adsorption force per unit area is : Metal 1st, Semiconductors 2nd, Insulator 3rd.

■ Operational Environment
(1) Atmospheric Pressure.
(2) Vacuum Environment.

■ What’s Electrostatic Chuck
The electrostatic chuck is a device for generating an attracting force between an electrode and an object at a voltage applied to the electrode.

​​■ Varieties of Electrostatic Chuck
(1) Coulomb-Fore Electrostatic Chuck
(2) Johnsen-Rahbek Electrostatic Chuck, or JR Electrostatic Chuck

■ Features of Patent Coulomb-Force E-Chuck
(1) Coulomb-Force Electrostatic Chuck.
(2) Patent Coulomb-Force E-Chuck was developed long time and has dozens of international patents.
(3) Stable and uniform adhesion force is achieved by applying the voltage to the electrode
(4) Apply lowest voltage to keep maximum adhesion force.
(5) Because voltage potential of object backside is zero, adhesion will not affect the backside circuits.
(6) Be able to adhere various materials : metal / semiconductor / glass / paper / porous materials.
(7) Work normally in a vacuum environments and general atmospheric environments.
(8) Cab define adhesion area and non-adhesion area. Non-adhesion area can define other functions.
(9) Can be made by different substrates. Such as stainless, aluminum, ceramic, semiconductor wafer or glass.
(10) Can be customized into various sizes and thicknesses for customer’s applications.
(11) Advanced technology enclose electrical field in the E-Chuck. E-Chuck become as move-free carrier.
(12) After adhesion setting, Move-Free Supporter can move freely even disconnecting the power supply. Move-Free support can support hardness or shape reinforcements for thin wafer or glass panel.

■ Main Handling Applications
​(1) Thin and large size flat glass.
(2) Semiconductor thin wafers.
(3) Big Size Wafer Handling and Moving.
(4) Warp wafers.
(5) Move-Free Shape Reinforcement Carrier (Eg, 4″ Wafer-on-6″ E-Chuck).
(6) Soft copper foil.
(7) Soft film.
(8) Curved glass.
(9) Vacuum Lamination for OLED or Touch Panel.
(10) Vacuum deposition.

■ Main Products

① (Move-Free) Thin Wafer Supporter
1. Be able to keep adhesion without power source connection.
2. Need connect controller for about 30 seconds to switch the adhesion state.
3. After adhesion setting, move-free supporter can keep adhesion status even disconnecting power.
4. Maximum operating temperature: 250 degrees centigrade.
5. Suitable for soft and thin object carriers. (Eg, thin wafer, thin glass panel, 4″wafer-on-6″chuck Shape Reinforcement Carrier).

② (Wired) Stage Holder
1. Real time power switch to set adsorption or release.
2. Maximum operating temperature: 200 degrees centigrade (E-Chuck surface).
3. Suitable for automation equipments. (Eg, curved glass, borderless screen, OLED vacuum Lamination.)

③ (Cordless) Palm:
1. Use battery as power source.
2. Suitable to adhere small and lightweight objects. (Eg, ​ 12 “wafers, 7″ flat glass.)

④ Other Custom E-Chuck:
1. Patent Cordless Holder (built-in battery, suitable for conveying lightweight objects)
2. Patent Electric Belt (curved cylinder shape E-Chuck) (Eg, Paper Printer.)
3. Anti-wrinkle E-Chuck (Eg, soft copper foil.)
​4. 3D Curved E-Chuck.

■ Demo Video :
Patent Coulomb-Force E-Chuck (Electrostatic Chuck) for Thin/Warp Materials and Vacuum Environments

⓪Patent Advanced E-Chuck Ability Demo : Adsorb Conductor, Semiconductor, Insulator

①(Move-Free) Supporter : Thin Warpage Wafer Support Handling

②(Wired) Stage Holder : Glass & Paper Adhesion

③(Cordless) Palm : Semiconductor Wafer Adsorption

④Custom : Copper Foil Adhesion

Contact info :
E-mail : [email protected]
EDRAGON TECHNOLOGY CORPORATION

Μονάδα τεμαχισμού / Shredder, για τον τεμαχισμό διακοπτών, πλακετών, φις, καλωδίων κλπ. που προέρχονται από αυτοκίνητα, της Αυστριακής εταιρείας WAGNER Maschinenbau GmbH , τύπου WS 15.
Κατασκευαστής: WAGNER Maschinebau GmbH
Panoramastrasse 13, A-8385 Neuhaus/Klb.
Tel.: 0043 3329 2478-13 Fax: 0043 3329 2478-15
[email protected], www.wagner-shredder.at