Good quality 100% Modular Belts P=0.75″ Belt Har 5936 flush grid for Algeria Importers

Har 5936 flush grid     

Thickness: 8.5mm     

Opening area: 16%

It is easy to clean and can resist heat because of good plastic rubber material. The modular belts plus baffle can prevent the products from falling when conveying. We are a leading manufacturer of modular belts with professional team; we can provide you with excellent quality items. This kind of modular belt can be used in the following industries:

Beverage industry such as acceleration, depletive and accumulation.
Food industry such as cool off lines and pack lines.
Meat industry such as tray pack line and metal detectors.

It is mainly used in food, soft drink, packaging & manufacturing, tobacco, medicine & chemical, electronics, automobiles and logistics industries. It can also be used in meat poultry applications including packaging lines, making/filling lines and accumulation tables. What is more, widely used in such machinery industries as alcoholic and beverage, food & cold food, tobacco, (pillow-type) packaging, chemicals, pharmacy, cosmetic, bottle-making, jar-making, post & telecommunication, and painting engineering.

https://www.pacceram.com/inventory/kilns/belt_furnaces_PC12051.html BTU International Belt Furnace, Model TXA96-9-144N24,Work Area: 9″W x 6″H x 144″ Heated, Electric, 230 Volt, 3 Phase, 51 KW, Max. Temp. 1150 deg.C., Delta F Oxygen monitor mounted in front panel, flow meters for Nitrogen entrance and exit curtains, Nitrogen adn Argon chamber flow area also mounted on front panel, Standard BTU mesh belt furnace design with full length alloy muffle, 24″ long load table prior to entering furnace, Nitrogen atmosphere curtains located on both entrance and exit ends, (9) heated zones, each zone 18″ long, heating elements in vacuum formed ceramic fiber modules located over and under muffle, furnace uses nitrogen and argon a atmospheric gases, heated section zones 1-6 then unheated area 12″ long followed by zones 7-9, there is 24″ cooling chamber followed by 36″ nitrogen curtain, variable speed belt control allows many different processes to be run, Condition: Excellent, Overall 37″W x 27’8″L x 67″H.

■ Patent Coulomb-Force E-Chuck (Electrostatic Chuck) :

​Patent Coulomb-Force E-Chuck has been developed long time and has dozens of international patents.

Advanced technology enclose electrical field in the E-Chuck. E-Chuck become a move-free carrier. After adhesion setting, Move-Free Supporter can disconnect the power supply and still keep adhesion force. Move-Free support can support hardness or shape reinforcements for thin wafer or glass panel.

Patent Coulomb-Force E-Chuck has best characteristics than many electrostatic chucks under long-term advanced researches and developments. Patent Coulomb-Force E-Chuck is a ideal handling tool for soft and thin materials.

■ Adsorbable Material
(1) Metal conductor (e.g., copper foil)
(2) Semiconductors (e.g., silicon, GaAs)
(3) Insulators (e.g., paper, glass panel)
(4) Porous objects.
(5) The adsorption force per unit area is related to the adsorption material and the contact surface smoothness.
(6) Material ranking of the adsorption force per unit area is : Metal 1st, Semiconductors 2nd, Insulator 3rd.

■ Operational Environment
(1) Atmospheric Pressure.
(2) Vacuum Environment.

■ What’s Electrostatic Chuck
The electrostatic chuck is a device for generating an attracting force between an electrode and an object at a voltage applied to the electrode.

​​■ Varieties of Electrostatic Chuck
(1) Coulomb-Fore Electrostatic Chuck
(2) Johnsen-Rahbek Electrostatic Chuck, or JR Electrostatic Chuck

■ Features of Patent Coulomb-Force E-Chuck
(1) Coulomb-Force Electrostatic Chuck.
(2) Patent Coulomb-Force E-Chuck was developed long time and has dozens of international patents.
(3) Stable and uniform adhesion force is achieved by applying the voltage to the electrode
(4) Apply lowest voltage to keep maximum adhesion force.
(5) Because voltage potential of object backside is zero, adhesion will not affect the backside circuits.
(6) Be able to adhere various materials : metal / semiconductor / glass / paper / porous materials.
(7) Work normally in a vacuum environments and general atmospheric environments.
(8) Cab define adhesion area and non-adhesion area. Non-adhesion area can define other functions.
(9) Can be made by different substrates. Such as stainless, aluminum, ceramic, semiconductor wafer or glass.
(10) Can be customized into various sizes and thicknesses for customer’s applications.
(11) Advanced technology enclose electrical field in the E-Chuck. E-Chuck become as move-free carrier.
(12) After adhesion setting, Move-Free Supporter can move freely even disconnecting the power supply. Move-Free support can support hardness or shape reinforcements for thin wafer or glass panel.

■ Main Handling Applications
​(1) Thin and large size flat glass.
(2) Semiconductor thin wafers.
(3) Big Size Wafer Handling and Moving.
(4) Warp wafers.
(5) Move-Free Shape Reinforcement Carrier (Eg, 4″ Wafer-on-6″ E-Chuck).
(6) Soft copper foil.
(7) Soft film.
(8) Curved glass.
(9) Vacuum Lamination for OLED or Touch Panel.
(10) Vacuum deposition.

■ Main Products

① (Move-Free) Thin Wafer Supporter
1. Be able to keep adhesion without power source connection.
2. Need connect controller for about 30 seconds to switch the adhesion state.
3. After adhesion setting, move-free supporter can keep adhesion status even disconnecting power.
4. Maximum operating temperature: 250 degrees centigrade.
5. Suitable for soft and thin object carriers. (Eg, thin wafer, thin glass panel, 4″wafer-on-6″chuck Shape Reinforcement Carrier).

② (Wired) Stage Holder
1. Real time power switch to set adsorption or release.
2. Maximum operating temperature: 200 degrees centigrade (E-Chuck surface).
3. Suitable for automation equipments. (Eg, curved glass, borderless screen, OLED vacuum Lamination.)

③ (Cordless) Palm:
1. Use battery as power source.
2. Suitable to adhere small and lightweight objects. (Eg, ​ 12 “wafers, 7″ flat glass.)

④ Other Custom E-Chuck:
1. Patent Cordless Holder (built-in battery, suitable for conveying lightweight objects)
2. Patent Electric Belt (curved cylinder shape E-Chuck) (Eg, Paper Printer.)
3. Anti-wrinkle E-Chuck (Eg, soft copper foil.)
​4. 3D Curved E-Chuck.

■ Demo Video :
Patent Coulomb-Force E-Chuck (Electrostatic Chuck) for Thin/Warp Materials and Vacuum Environments

⓪Patent Advanced E-Chuck Ability Demo : Adsorb Conductor, Semiconductor, Insulator

①(Move-Free) Supporter : Thin Warpage Wafer Support Handling

②(Wired) Stage Holder : Glass & Paper Adhesion

③(Cordless) Palm : Semiconductor Wafer Adsorption

④Custom : Copper Foil Adhesion

Contact info :
E-mail : [email protected]
EDRAGON TECHNOLOGY CORPORATION