Factory provide nice price The series of Har-882 plastic slat top chains to Czech Republic Importers

Pitch:38.1(mm) 

Thickness:20(mm)

Working load:2130(N)

Har-882, Har-882 TAB and Har-882 TAB and Har-882 PRR-TAB belongs to the turn top chains. The material of All-Ka chain products are POM. They can achieve change the orientation in the process of operation. Besides, The series of Har -882 plastic slat top chains also can easily installation and maintenance and it has high mechanical strength. In addition, our products are widely used in food, beverage, pet bottles and aluminum cans as well as all kinds of containers transport. The detailed size can be available as your requirement, thus as long as you give me the drawing or detailed specification, everything is okay. So All-Ka has the products to suit any customer requirement.

INTERNATIONAL WIRENETTING INDUSTRIES offers wide range of Stainless Steel Wire Mesh in all sizes and grade.
Enquiry Now. https://kompass.in/wire-mesh/contact-us/

We are manufacturer,exporter of Stainless Steel Wire Mesh.
Incepted in year 1993, “International Wirenetting” is emerging as one the renowned manufacturer and exporter of comprehensive range of products. Our product line includes Square Mesh, Barbed Wire, Vibrating Screens, Industrial Filters, Demister Pad, Universal Screens, Perforated Sheets, Chain Link Fencing, Crimped Wire Mesh and Conveyor Belts. Entire range is precisely designed and tested in compliance with the set quality norms. We also customize our range as per the specific details of our clients. Our range finds applications in several industrial, commercial and domestic works.

We, International Wirenetting Industries have adopted advanced technology & equipments to produce unique range of products as per the demands of our clients. Our range is delivered only after the strict quality checks within promised time frame. We have gained complete client satisfaction by providing high quality products and have created a positive image in the markets.

We, International Wirenetting Industries are able to climb the ladder of success under the sincere and dedicated guidance of our founder Mr. Vimal Jain. He possesses vast industry experience and sharp business acumen that allows us to expand our business operation by leaps and bounds.

Growth
Today International Wirenetting Industries is a name to recon with in the wire mesh industry. With a steady Growth rate of over 25% per annum. It has estblished itself as a strong and quality in the global market.

Exports
With their tradition of our three decades, to satisfy all their customers requirements from an immedieate demand to wiremesh management, promptly efficently & competently the International Wirenetting Industries group specializes in combining material availibility with expertise to develop the most coast effctive wiremesh in order to meet the highly competitive internatiol market. Backed by its dedicated export department & its network in various countries.
International Wirenetting Industries has the ability to despatch meterial and to ensure that the immediate and ongoing needs of the clients are met worldwide. In a very short span it has managed to execute orders from arround the globe. In fact it is our company in india to have supplied in the UAE market in its own brand name. With an unrivalled track record for long term support, exellent service and dedication to quality, the company has been rated as the first certain chioces of wiremesh by many loyal buyers in the international markets.

Vision & Mision
Mission : Our organization’s mission is to achieve total consumer satisfaction by delivering stature products and consolidated services to our valuable clients at most resonable rate. We also endeavor to develop epipome of ethical and long lasting relationship both with our customers and vendors.

Vision : Achieve a numero uno position in wire mesh industry in terms of volume, turnover and quality in global market

■ Patent Coulomb-Force E-Chuck (Electrostatic Chuck) :

​Patent Coulomb-Force E-Chuck has been developed long time and has dozens of international patents.

Advanced technology enclose electrical field in the E-Chuck. E-Chuck become a move-free carrier. After adhesion setting, Move-Free Supporter can disconnect the power supply and still keep adhesion force. Move-Free support can support hardness or shape reinforcements for thin wafer or glass panel.

Patent Coulomb-Force E-Chuck has best characteristics than many electrostatic chucks under long-term advanced researches and developments. Patent Coulomb-Force E-Chuck is a ideal handling tool for soft and thin materials.

■ Adsorbable Material
(1) Metal conductor (e.g., copper foil)
(2) Semiconductors (e.g., silicon, GaAs)
(3) Insulators (e.g., paper, glass panel)
(4) Porous objects.
(5) The adsorption force per unit area is related to the adsorption material and the contact surface smoothness.
(6) Material ranking of the adsorption force per unit area is : Metal 1st, Semiconductors 2nd, Insulator 3rd.

■ Operational Environment
(1) Atmospheric Pressure.
(2) Vacuum Environment.

■ What’s Electrostatic Chuck
The electrostatic chuck is a device for generating an attracting force between an electrode and an object at a voltage applied to the electrode.

​​■ Varieties of Electrostatic Chuck
(1) Coulomb-Fore Electrostatic Chuck
(2) Johnsen-Rahbek Electrostatic Chuck, or JR Electrostatic Chuck

■ Features of Patent Coulomb-Force E-Chuck
(1) Coulomb-Force Electrostatic Chuck.
(2) Patent Coulomb-Force E-Chuck was developed long time and has dozens of international patents.
(3) Stable and uniform adhesion force is achieved by applying the voltage to the electrode
(4) Apply lowest voltage to keep maximum adhesion force.
(5) Because voltage potential of object backside is zero, adhesion will not affect the backside circuits.
(6) Be able to adhere various materials : metal / semiconductor / glass / paper / porous materials.
(7) Work normally in a vacuum environments and general atmospheric environments.
(8) Cab define adhesion area and non-adhesion area. Non-adhesion area can define other functions.
(9) Can be made by different substrates. Such as stainless, aluminum, ceramic, semiconductor wafer or glass.
(10) Can be customized into various sizes and thicknesses for customer’s applications.
(11) Advanced technology enclose electrical field in the E-Chuck. E-Chuck become as move-free carrier.
(12) After adhesion setting, Move-Free Supporter can move freely even disconnecting the power supply. Move-Free support can support hardness or shape reinforcements for thin wafer or glass panel.

■ Main Handling Applications
​(1) Thin and large size flat glass.
(2) Semiconductor thin wafers.
(3) Big Size Wafer Handling and Moving.
(4) Warp wafers.
(5) Move-Free Shape Reinforcement Carrier (Eg, 4″ Wafer-on-6″ E-Chuck).
(6) Soft copper foil.
(7) Soft film.
(8) Curved glass.
(9) Vacuum Lamination for OLED or Touch Panel.
(10) Vacuum deposition.

■ Main Products

① (Move-Free) Thin Wafer Supporter
1. Be able to keep adhesion without power source connection.
2. Need connect controller for about 30 seconds to switch the adhesion state.
3. After adhesion setting, move-free supporter can keep adhesion status even disconnecting power.
4. Maximum operating temperature: 250 degrees centigrade.
5. Suitable for soft and thin object carriers. (Eg, thin wafer, thin glass panel, 4″wafer-on-6″chuck Shape Reinforcement Carrier).

② (Wired) Stage Holder
1. Real time power switch to set adsorption or release.
2. Maximum operating temperature: 200 degrees centigrade (E-Chuck surface).
3. Suitable for automation equipments. (Eg, curved glass, borderless screen, OLED vacuum Lamination.)

③ (Cordless) Palm:
1. Use battery as power source.
2. Suitable to adhere small and lightweight objects. (Eg, ​ 12 “wafers, 7″ flat glass.)

④ Other Custom E-Chuck:
1. Patent Cordless Holder (built-in battery, suitable for conveying lightweight objects)
2. Patent Electric Belt (curved cylinder shape E-Chuck) (Eg, Paper Printer.)
3. Anti-wrinkle E-Chuck (Eg, soft copper foil.)
​4. 3D Curved E-Chuck.

■ Demo Video :
Patent Coulomb-Force E-Chuck (Electrostatic Chuck) for Thin/Warp Materials and Vacuum Environments

⓪Patent Advanced E-Chuck Ability Demo : Adsorb Conductor, Semiconductor, Insulator

①(Move-Free) Supporter : Thin Warpage Wafer Support Handling

②(Wired) Stage Holder : Glass & Paper Adhesion

③(Cordless) Palm : Semiconductor Wafer Adsorption

④Custom : Copper Foil Adhesion

Contact info :
E-mail : [email protected]
EDRAGON TECHNOLOGY CORPORATION